型番:FL-AMC-4045、FL-AMC-4048、FL-AMC-4557 メーカー:Focuslight Technologies Inc. 商品コード:L003762
材質: AuSn Pre-Deposited AlN Ceramic Substrates、AuSn Pre-Deposited CuW Substrates
< AMC >
・AuSn pre-deposited DPC materials
・Low thermal resistance <2.1K/W
・Copper clad layer
・CTE matched for chip bonding
・High reliability
< Applications >
・Telecommunication
・Fiber Laser Pumping Components
・Industrial Application
・Scientific Research and Engineering
< AuSn Pre-Deposited AlN Ceramic Substrates >
As the submount for the heat dissipation of high-power diode laser chips, the AuSn pre-deposited DPC material is fabricated through metallization of AlN ceramic substrate and pre-deposition of micron-level AuSn thin film in specific areas. It is a key technology that ensures the long-term reliable use of optoelectronic devices.
< AuSn Pre-Deposited CuW Substrates >
As the submount for the heat dissipation of high-power diode laser bar chips, the AuSn pre-deposited CuW material is fabricated through pre-deposition of micron-level AuSn thin film in specific areas of copper-tungsten substrates. It is a key technology that ensures the long-term reliable use of optoelectronic devices.
価格 | 地域 | 代理店 | |
---|---|---|---|
要問い合わせ | 株式会社ハナムラオプティクス | ||
要問い合わせ | 京都府 | 株式会社光響 | |